Chipmos Technologies (NASDAQ: IMOS) and Amkor Technology (NASDAQ:AMKR) are both computer and technology companies, but which is the superior investment? We will contrast the two companies based on the strength of their profitability, dividends, valuation, analyst recommendations, earnings, risk and institutional ownership.
Volatility and Risk
Chipmos Technologies has a beta of 0.18, meaning that its share price is 82% less volatile than the S&P 500. Comparatively, Amkor Technology has a beta of 2.62, meaning that its share price is 162% more volatile than the S&P 500.
Chipmos Technologies pays an annual dividend of $0.46 per share and has a dividend yield of 2.6%. Amkor Technology does not pay a dividend. Chipmos Technologies pays out 17.4% of its earnings in the form of a dividend.
This table compares Chipmos Technologies and Amkor Technology’s net margins, return on equity and return on assets.
|Net Margins||Return on Equity||Return on Assets|
Valuation and Earnings
This table compares Chipmos Technologies and Amkor Technology’s gross revenue, earnings per share (EPS) and valuation.
|Gross Revenue||Price/Sales Ratio||Net Income||Earnings Per Share||Price/Earnings Ratio|
|Chipmos Technologies||$567.50 million||1.33||$43.24 million||$2.64||6.66|
|Amkor Technology||$3.89 billion||0.64||$164.19 million||$1.09||9.60|
Amkor Technology has higher revenue and earnings than Chipmos Technologies. Chipmos Technologies is trading at a lower price-to-earnings ratio than Amkor Technology, indicating that it is currently the more affordable of the two stocks.
Insider and Institutional Ownership
16.5% of Chipmos Technologies shares are owned by institutional investors. Comparatively, 39.4% of Amkor Technology shares are owned by institutional investors. 58.1% of Amkor Technology shares are owned by company insiders. Strong institutional ownership is an indication that hedge funds, endowments and large money managers believe a stock is poised for long-term growth.
This is a breakdown of current ratings and target prices for Chipmos Technologies and Amkor Technology, as provided by MarketBeat.
|Sell Ratings||Hold Ratings||Buy Ratings||Strong Buy Ratings||Rating Score|
Amkor Technology has a consensus target price of $10.50, suggesting a potential upside of 0.38%. Given Amkor Technology’s higher probable upside, analysts plainly believe Amkor Technology is more favorable than Chipmos Technologies.
Amkor Technology beats Chipmos Technologies on 8 of the 14 factors compared between the two stocks.
Chipmos Technologies Company Profile
ChipMOS TECHNOLOGIES INC is a Taiwan-based company principally engaged in the integrated circuits packaging and testing business. The Company mainly provides thin small outline packaging (TSOP), fine-pitch ball grid array (FBGA) packaging, tape carrier packaging (TCP) and chip on film (COF) packaging services, as well as gold bumping services, among others. The Company’s products and services are used in information products, personal computers, communications equipment, office automation and consumer electronics. It mainly operates its business within domestic market, and in overseas markets, including the rest of Asia and the Americas.
Amkor Technology Company Profile
Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company’s packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company’s mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.
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